Reduction of CTE in Semiconductor Packages and Warpage Countermeasures

Description

This is a request, not an immediate purchase. Delivery takes about one week. Your card is authorized but not charged until the English PDF is ready.

Product ID: 1152

Publisher: Gijutsu Joho Kyokai

Publication Date: 2026-07-01

English Summary

English catalog entry for a Japanese market intelligence report by Gijutsu Joho Kyokai. Publication date: 2026-07-01. This page is an original catalog description, not a full translation of the Japanese edition.

Contents / Coverage

• Chapter 1: Development Trends of Element Technologies for Miniaturization and Integration of Semiconductor Packages
• Chapter 2: Development Trends of Filler Materials Enabling Improved Thermal Conductivity and Low Thermal Expansion
• Chapter 3: Development Trends of Negative Thermal Expansion Materials
• Chapter 4: Surface Treatment, Dispersion, and Filling Techniques for Fillers
• Chapter 5: Development Trends of Low Thermal Expansion Substrate Materials and Glass Substrates
• Chapter 6: Development of Semiconductor Encapsulation Materials and Stress Reduction
• Chapter 7: Development of Joining Materials
• Chapter 8: Development Trends of Low CTE Resin Materials
• Chapter 9: Evaluation and Simulation Techniques in Semiconductor Package Materials

Why This May Matter Internationally

This publication addresses key developments in semiconductor packaging technologies, focusing on the reduction of Coefficient of Thermal Expansion (CTE) and strategies to mitigate warpage, which are critical for global semiconductor manufacturing.

Keywords: semiconductor,CTE reduction,warpage,packaging technology,materials development