Foundations and Applications of Photonic-Electronic Integration and CPO Technology

Description

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Product ID: 1162

Publisher: Johokiko

Publication Date: 2026-06-25

English Summary

This book provides a systematic overview of photonic-electronic integration technology and Co-Packaged Optics (CPO), highlighting its relevance in AI data centers, next-generation communications, and power consumption challenges. It covers everything from optical devices to packaging and applications, making it a valuable resource for engineers and researchers interested in these fields.

Contents / Coverage

• Chapter 1: Rising Expectations and Roadmap for Photonic-Electronic Integration Technology/CPO Technology
• Chapter 2: Core Technologies of Optical Devices and Specific Application Circuits
• Chapter 3: Packaging Technology
• Chapter 4: Trends in Materials and Component Technologies
• Chapter 5: Measurement and Evaluation Technologies
• Chapter 6: Application Examples

Why This May Matter Internationally

As the demand for advanced communication technologies and energy-efficient solutions grows globally, this book addresses critical advancements in photonic-electronic integration and CPO technology, which are essential for future infrastructure developments.

Keywords: photonic-electronic integration,CPO technology,AI data centers,next-generation communications,packaging technology,optical devices