Trends in the Development of Joining Technologies and Materials for Semiconductor Devices and Reliability Evaluation
¥100 ,000
This publication explores the latest advancements in joining technologies and materials specifically for semiconductor devices, along with their reliability evaluations. It provides insights into the development processes and materials used in cutting-edge semiconductor packaging, power semiconductors, and electronic devices.
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Description
This is a request, not an immediate purchase. Delivery takes about one week. Your card is authorized but not charged until the English PDF is ready.
Product ID: 1150
Publisher: Gijutsu Joho Kyokai
Publication Date: 2026-08-01
English Summary
This publication explores the latest advancements in joining technologies and materials specifically for semiconductor devices, along with their reliability evaluations. It provides insights into the development processes and materials used in cutting-edge semiconductor packaging, power semiconductors, and electronic devices.
Contents / Coverage
- Chapter 1: Joining and Adhesive Technologies for Advanced Semiconductor Packaging and Their Material Development and Reliability Evaluation
- Chapter 2: Development and Reliability Evaluation of Joining Materials and Processes for Power Semiconductors
- Chapter 3: Development and Reliability Evaluation of Joining Technologies and Materials in Electronic Devices
Why This May Matter Internationally
As semiconductor technology continues to evolve globally, understanding the latest joining techniques and materials is crucial for engineers and researchers in the field. This book addresses key developments that can impact various applications worldwide.
Keywords: Japan,technical book,Gijutsu Joho Kyokai,semiconductor