Heat Dissipation and Cooling Technologies for AI Data Centers and HPC
¥87 ,500
English catalog entry for a Japanese market intelligence report by Gijutsu Joho Kyokai. Publication date: 2026-03-01. This page is an original catalog description, not a full translation of the Japanese edition.
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Description
This is a request, not an immediate purchase. Delivery takes about one week. Your card is authorized but not charged until the English PDF is ready.
Product ID: 1158
Publisher: Gijutsu Joho Kyokai
Publication Date: 2026-03-01
English Summary
English catalog entry for a Japanese market intelligence report by Gijutsu Joho Kyokai. Publication date: 2026-03-01. This page is an original catalog description, not a full translation of the Japanese edition.
Contents / Coverage
- Chapter 1: Market Trends of AI and Generative AI Data Centers and Required Heat Dissipation and Cooling Technologies
- Chapter 2: Development Trends of Heat Dissipation Materials and Components for Electronic Devices Driving AI and HPC, and Responses to High Heat Density
- Chapter 3: Application of Cooling Technologies for Stable Operation of AI and Generative AI, and Responses to Rapid Heat Generation
- Chapter 4: Heat Design, Analysis, and Simulation in Advanced Semiconductors and Electronic Devices
- Chapter 5: Heat Dissipation and Cooling Technologies for Devices and Equipment Incorporating AI and Generative AI
Why This May Matter Internationally
This publication addresses the critical heat dissipation and cooling technologies necessary for the operation of AI data centers and high-performance computing (HPC) systems, which are increasingly relevant in global technology markets.
Keywords: AI,HPC,cooling technologies,heat dissipation,semiconductors,Japan