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English catalog entry for a Japanese market intelligence report by Gijutsu Joho Kyokai. Publication date: 2026-03-01. This page is an original catalog description, not a full translation of the Japanese edition.
This publication introduces the role and composition of Thermal Interface Materials (TIMs) and explains the latest trends in TIM products in the market. It covers the development of thermally conductive fillers and their surface treatment technologies, high thermal conductivity resins, and heat dissipation sheets. The book also presents practical application examples focused on automotive uses and semiconductor packaging, including gap fillers, thermal design methods, and evaluation techniques.
