Next-Generation Semiconductor Packaging Technology
¥72 ,500
This technical book provides an in-depth exploration of semiconductor packaging technologies, focusing on the latest advancements and methodologies. It covers essential topics from the semiconductor packaging roadmap to inspection and evaluation techniques, making it a valuable resource for professionals in the field.
This is a request, not an immediate purchase. Your card is authorized but not charged. Delivery takes about one week. We capture payment when the English PDF is ready.
Description
This is a request, not an immediate purchase. Delivery takes about one week. Your card is authorized but not charged until the English PDF is ready.
Product ID: 1168
Publisher: Johokiko
Publication Date: 2025-11-25
English Summary
This technical book provides an in-depth exploration of semiconductor packaging technologies, focusing on the latest advancements and methodologies. It covers essential topics from the semiconductor packaging roadmap to inspection and evaluation techniques, making it a valuable resource for professionals in the field.
Contents / Coverage
- Chapter 1: Semiconductor Packaging Roadmap
- Chapter 2: Semiconductor Backend Packaging Technology: Basics and Troubleshooting
- Chapter 3: Trends in Cutting-Edge Semiconductor Packaging Technology
- Chapter 4: Materials/Devices and Required Performance for Latest Packaging Technologies
- Chapter 5: Inspection and Evaluation Techniques for Semiconductor Packages
- Chapter 6: Semiconductor Packaging from an Application Perspective
Why This May Matter Internationally
As semiconductor technology continues to evolve globally, understanding the latest packaging techniques is crucial for engineers and companies involved in electronics and semiconductor manufacturing. This book serves as a comprehensive guide for those looking to stay updated with current trends and technologies in semiconductor packaging.
Keywords: Japan,technical book,Johokiko,semiconductor,packaging technology