Latest Developments in High Thermal Conductivity and Heat Dissipation Materials: Optimal Adjustments and Application Developments – Frontiers of TIMs and Applications in Automotive and Semiconductor Packaging
¥62 ,500This publication introduces the role and composition of Thermal Interface Materials (TIMs) and explains the latest trends in TIM products in the market. It covers the development of thermally conductive fillers and their surface treatment technologies, high thermal conductivity resins, and heat dissipation sheets. The book also presents practical application examples focused on automotive uses and semiconductor packaging, including gap fillers, thermal design methods, and evaluation techniques.