SiC

This publication systematically explains the fundamental operating principles of power devices, focusing on the latest device structures based on Si, SiC, and GaN, along with development trends, challenges, and future prospects. It also details the latest trends in materials and process technologies that support power device implementation, including sintered copper, sintered silver bonding materials, encapsulation materials, and high-heat-resistant resins. Additionally, it introduces specific application examples and the value of power devices from a system perspective in areas such as automotive, renewable energy, power conversion, and a decarbonized society.