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This book consolidates cutting-edge research on easily disassemblable adhesive technology, offering insights from renowned researchers and engineers. It covers materials, analysis, applications, and the overall landscape of this innovative adhesive technology, particularly its relevance in the automotive industry.
This publication explores the latest trends in material development through materials informatics and quantum computing. It provides concrete points for implementation and utilization, along with case studies from various companies. The book also delves into methods of material exploration using generative AI, particularly natural language processing, automation, and virtualization. Additionally, it presents examples of material development utilizing materials informatics, including environmentally friendly materials, organic-inorganic hybrid materials, and dielectric materials. The implications of materials informatics for carbon neutrality and future prospects in material development are also discussed.
This publication discusses the mechanisms of nanoimprint lithography, various initiatives aimed at semiconductor fine processing applications, the development and practical implementation of equipment, and prospects for device applications. It also evaluates the release issues associated with nanoimprint lithography and presents strategies to address them, alongside an overview of domestic and international trends and future outlooks.
